| Mfr Package Description |
WINDOWED, FRIT SEALED, CERAMIC, DIP-28 |
| Status |
Discontinued |
| Sub Category |
EPROMs |
| Access Time-Max |
450.0 ns |
| I/O Type |
COMMON |
| JESD-30 Code |
R-GDIP-T28 |
| JESD-609 Code |
e0 |
| Memory Density |
65536.0 bit |
| Memory IC Type |
UVPROM |
| Memory Width |
8 |
| Number of Functions |
1 |
| Number of Terminals |
28 |
| Number of Words |
8192.0 words |
| Number of Words Code |
8K |
| Operating Mode |
ASYNCHRONOUS |
| Operating Temperature-Min |
0.0 Cel |
| Operating Temperature-Max |
70.0 Cel |
| Organization |
8KX8 |
| Output Characteristics |
3-STATE |
| Package Body Material |
CERAMIC, GLASS-SEALED |
| Package Code |
WDIP |
| Package Equivalence Code |
DIP28,.6 |
| Package Shape |
RECTANGULAR |
| Package Style |
IN-LINE, WINDOW |
| Parallel/Serial |
PARALLEL |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Power Supplies (V) |
5 |
| Programming Voltage (V) |
12.5 |
| Qualification Status |
Not Qualified |
| Seated Height-Max |
5.71 mm |
| Supply Current-Max |
0.075 Amp |
| Supply Voltage-Nom (Vsup) |
5.0 V |
| Supply Voltage-Min (Vsup) |
4.75 V |
| Supply Voltage-Max (Vsup) |
5.25 V |
| Surface Mount |
NO |
| Technology |
NMOS |
| Temperature Grade |
COMMERCIAL |
| Terminal Finish |
Tin/Lead (Sn/Pb) |
| Terminal Form |
THROUGH-HOLE |
| Terminal Pitch |
2.54 mm |
| Terminal Position |
DUAL |
| Width |
15.24 mm |
